When holding the solder to the tip of the soldering-iron the flux evaporates. This moment is best suited for soldering. It causes bubbles when the flux has evaporated or when too much solder is used. These bubbles do not produce save contacts.
Eyelets and wire of the building part must be heated simultaneously. The building parts can stand even high temperatures.
Repeatedly touch the solder joint with the solder until the drill hole in the eyelet is completely closed. Bubbles must be avoided.
By running up the left- over wire with the tip of the soldering- iron, superfluous solder is easily removed.
Put away the soldering- iron and remove overlaying wires with the wire-cutting pliers.
Caution!
Close your eyes or wear goggles! The endings of the wire may shot out like little bullets.
Caution! Bridges between the eyelets are to be avoided.
If you cannot remove the superfluous solder with the clean tip of the soldering- iron use a suction pump.
The IC- base easily slips when you turn the conductor plate. A heat-resistant mat helps.
The small indent serves as a marker and should be turned to the left.
C a u t i o n !
Do not hold with the fingers from below while soldering from the top.
Danger of burns!
The legs of the microcontroller are usually bend slightly to the outside. In order for them to fit comfortable with the base you have to bend them slightly inwards. The microcontroller also features a small indent that has to by turned to the left.
Press tightly with two thumbs on the edge of a table.
As with a quartz watch a quartz is responsible for the exact pulsing of the microcontroller of the Game Kit at a frequency of 16 megahertz. (Polarity is unimportant.)
Attention! Touching the quartz during operation leads to system failure of the microcontroller.
Two small 22p capacitors on the left and on the right stabilise the pulsing of the quartz.
Because symmetrical capacitors are used polarity can be disregarded.
© olaf val, 2024